Quartz Wafer 4-Inch High Purity Double-Side Polished Substrate: Precision for Cutting-Edge Semiconductor and Optical Technologies

Introduction

In industries where precision and material integrity are non-negotiable, the Quartz Wafer 4-Inch High Purity Double-Side Polished Substrate serves as a critical foundation for innovation. Crafted from synthetic fused silica (SiO₂), this substrate combines ultra-high purity, atomic-level surface smoothness, and exceptional thermal resilience, making it indispensable for semiconductor manufacturing, advanced optics, and MEMS applications. This article explores its technical specifications, use cases, and why it stands out in high-tech production environments.

Key Features

1. Ultra-High Purity (99.99% SiO₂)
   Synthetic fused silica with metallic impurities <1 ppm, ensuring contamination-free processes for EUV lithography and sensitive optical applications.

2. Double-Side Polished Precision
   Both surfaces polished to <0.5 nm (Ra) roughness, enabling defect-free thin-film deposition, lithography, and optical coatings.

3. Exceptional Thermal Stability
   Near-zero thermal expansion (CTE: 0.55 × 10⁻⁶/°C), maintaining dimensional integrity under extreme temperatures (up to 1,200°C).

4. Broad Optical Transparency
   High transmittance (>90%) across UV (190 nm) to IR (2,500 nm) spectra, ideal for deep-UV lithography, laser optics, and sensor systems.

5. Chemical and Plasma Resistance
   Resists acids, alkalis, and plasma etching, ensuring durability in harsh semiconductor fabrication and cleaning cycles.

6. SEMI-Compliance
   Meets SEMI standards for flatness (<3 µm TTV), thickness uniformity (±10 µm), and defect density, compatible with 100mm fab tools.

Applications

• Semiconductor Lithography: Photomasks for advanced nodes in EUV/DUV lithography processes.

• MEMS & Sensors: Precision substrates for accelerometers, biochips, and microfluidic devices.

• Optical Systems: Lenses, prisms, and windows for high-power lasers and aerospace optics.

• Quantum Technologies: Base material for photonic circuits and quantum dot arrays.

• R&D Prototyping: Cost-effective solution for developing next-gen devices in compact formats.

Why Choose a 4-Inch Quartz Substrate?

• Cost-Efficiency: Compact 4-inch (100mm) size reduces material waste for small-batch production and R&D.

• Enhanced Precision: Ultra-smooth surfaces improve yield in nanoscale patterning and thin-film processes.

• Scalability: Compatible with automated handling tools, bridging prototyping to mid-volume manufacturing.

• Future-Ready Design: Supports emerging trends like integrated photonics and 3D IC packaging.

• Regulatory Compliance: Certified to SEMI, ISO, and MIL-STD standards for quality assurance.

Conclusion

The 4-inch Quartz Wafer High Purity Double-Side Polished Substrate is a cornerstone of precision in semiconductor, optical, and MEMS industries. Its unparalleled purity, thermal stability, and atomic-level surface quality empower engineers and researchers to achieve breakthroughs in efficiency and miniaturization. Whether for EUV lithography, quantum research, or advanced optics, this substrate delivers the reliability and performance required to lead in a competitive technological landscape.