Silicon wafer 4inch N Type(111) 6~12Ω Silver Layer 100nm Semiconductor Substrate

4-Inch N-Type (111) Silicon Wafer with 6~12Ω Resistivity and 100nm Silver Layer: Precision for Optoelectronics and Sensors

Introduction: Bridging Conductivity and Optical Performance

In the evolving landscape of optoelectronics and high-frequency devices, substrates must balance electrical performance with optical functionality. The 4-inch N-Type (111) Silicon Wafer, with a 6~12Ω·cm resistivity and a 100nm silver (Ag) layer, offers a unique synergy of conductivity, reflectivity, and process adaptability. This article delves into its technical specifications, applications, and why it stands out in precision-driven industries.


Core Specifications and Technical Highlights

  1. Substrate Design

    • 4-Inch Diameter (100mm): Optimized for R&D prototyping, specialized sensors, and low-volume production.

    • N-Type Doping (Phosphorus/Arsenic): Provides free electrons for high-speed signal transmission and low-loss applications.

    • (111) Crystal Orientation: Enhances epitaxial growth uniformity for optoelectronic devices like LEDs and photodetectors.

  2. Resistivity Range (6~12Ω·cm)

    • Moderate resistivity balances conductivity and thermal stability, suitable for RF switchesmicrowave circuits, and sensor arrays.

    • Reduces parasitic capacitance in high-frequency designs.

  3. 100nm Silver (Ag) Layer

    • Sputtering/Evaporation Deposition: Ensures a smooth, adhesive silver coating with high reflectivity (>95% in visible spectrum).

    • Dual Functionality:

      • Conductive Layer: Lowers contact resistance for electrodes and interconnects.

      • Optical Reflector: Enhances light extraction in LEDs or acts as a mirror layer in photonic devices.



Advantages of the 100nm Silver Layer

  • Ultra-High Conductivity: Silver’s resistivity (~1.59×10⁻⁸Ω·m) outperforms most metals, reducing energy loss.

  • Optical Excellence: High reflectivity critical for light-emitting and sensing applications.

  • Corrosion Resistance: Silver’s inertness ensures long-term stability in harsh environments.

  • Thermal Conductivity: Efficient heat dissipation extends device lifespan in power-intensive systems.


Why Choose This Wafer?

  • Optoelectronic Optimization: Combines N-type (111) epitaxial readiness with silver’s optical properties.

  • Process Versatility: Compatible with lithography, etching, and thin-film deposition workflows.

  • Cost-Effective Reflectivity: Silver coating replaces gold in non-critical applications, lowering material costs.

  • Scalability: Supports niche R&D projects to pilot-scale production with consistent quality.


Conclusion: Redefining Precision in Optoelectronics and Beyond

The 4-inch N-Type (111) Silicon Wafer with 6~12Ω·cm resistivity and 100nm silver layer is a cornerstone for innovations requiring both electrical and optical precision. From energy-efficient lighting to next-gen sensors, its tailored design empowers engineers to achieve higher efficiency, miniaturization, and reliability.

Elevate your optoelectronic and high-frequency designs with this multifunctional substrate today!


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Major Applications of Silicon wafer 4inch N Type(111) 6~12Ω Silver Layer 100nm Semiconductor Substrate

Optoelectronics and Photonics High-Efficiency LEDs

Silver layer boosts light output by reflecting trapped photons. Laser Diodes: (111) orientation supports high-quality III-V material epitaxy for coherent light sources.

RF and Microwave Devices

Low-resistivity N-type substrate minimizes signal loss in 5G antennas and radar systems. Silver-coated interconnects enhance high-frequency signal integrity.

Sensors and MEMS

Gas/Bio-Sensors: Silver layer serves as a stable electrode or plasmonic enhancer for surface-sensitive detection. Infrared Detectors: Reflective coating improves IR absorption and thermal management.

Advanced Packaging

Silver layer enables low-resistance bonding pads for flip-chip and wafer-level packaging (WLP).

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