♦️High-quality SiC wafer for Research and Experiment.

♦️Provide thinning process, thickness from 100um.

♦️Global shipping, secure payment, large inventory.

♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.

SiC Substrate Specification:

• Size: 6inch;

• Diameter: 150mm±0.2;

• Thickness: 350 um±25;

• Surface Orientation: 4°toward[11-20]±5°;

• Primary flat orientation:[11-20]±5°；

• Secondary flat orientation: None；

• Micropipe: None;

• Resistivity: None;

• TTV≤10um；

• Warp≤60um；

• Bow≤40um；

• Surface Roughness: Si face Ra≤0.5 nm;

• Cracks: None;

• Wafer edge: Bevelling;

• Surface finish: Double Side Polish, Si Face CMP;

• Packing: Multi-wafer Cassette Or Single Wafer Container;

The difference between NG grade and Dummy grade products mainly in the poly area on the surface.
NG grade poly area is more than 5%.
NG grade products are mainly used for equipment testing and have better cost performance.